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23 | 02 | 2012
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Microwave & RF components design with Efield® PDF Imprimer Envoyer

Efield® is the industrial competitive software for S-parameter extraction, and 3D electromagnetic field simulation of high-frequency and high-speed components. Engineers can rely on the accuracy, capacity, and performance of Efield® to design on-chip embedded passives, IC packages, PCB interconnects, antennas, RF/microwave components, and biomedical devices.

Using Efield® solver tools such as the Efield® frequency domain MoM solver or the Efield® time domain FDTD-FEM solver most microwave and RF components can be analysed efficient and with good accuracy. Both solvers ensures an accurate representation of the geometry with body conforming meshing which is the most important feature for achieving accurate results for these applications.

 

Simulation of large structures of on-chip embedded passives
Efield® is particularly suitable for very large structures of on-chip embedded passives. PDF
Simulation of waveguide cavity filters
Simulation of a waveguide cavity diplex filter using Efield® FD MoM. PDF
 
Newsflash

La nouvelle version Efield 6.0 établit un nouveau standard de performances dans le cacul distribué haute performances HPC (voir le pdf).


 

 

Efield annonce la sortie d'une révision majeure 6.0 de sa suite logiciel (voir le pdf).


 

 
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